Archive for September, 2011

Dome array production process of mold

Friday, September 16th, 2011

Today we hereby to introduce the details of dome array production process of mold. Please see below steps:

1, The first to punch spacer by mold (punch the dome array holes and ventilation slots);

2, Then put mylar cover on spacer;

3, Use mold to punch location holes(for LED lights or others);

4, then cut the dome array into appropriate size;

5, Assemble metal domes by tooling;

6, QC for the loss, incorrect and doubles metal domes;

7, Cover protective film on back;

8, Punch the outline of dome array;

9, Final inspection  (including the product appearance, dirt, less metal domes, etc..);

10, Packaging.

The above is the details of dome array production process of mold, if you want to know more, please contact us.

Can metal domes afford high temperature reflow?

Wednesday, September 7th, 2011

Recently we received several customers asked whether the metal domes can afford high temperature reflow? and the metal domes if will have the deformations or force changed?

The material of metal dome is stainless steel, in general, our metal domes operating temperature is -40-100 degrees, so if the operating temperature close to 100 or more than 100,  there is definitely change for metal sanp domes, including force and resistance.

Some of the customers put the metal domes on the PCB, FPC and then SMT soldering, the temperature reaches 200 degrees, the performances will be definitely affected, and changed. Although we do not do this test, but is certainly metal snap domes can not pass the high temperature reflow. So now if it’s the only way to put metal dome on the PCB after reflow temperature , so does it work?

We hope to discuss with the friends who know this issues of metal domes, please leave your message. CMD manufacturing engage in providing a variety of solutions for customers.